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Sierra de corte CNC de precisión

1. Máquina cortadora de precisión impulsada por un motor paso a paso, tiene una velocidad de corte rápida y funciona suavemente, lo que garantiza un corte preciso de diversos materiales.
2. La máquina cortadora de precisión permite a los usuarios programarse y realizar fácilmente operaciones de corte complejas, adecuadas para una variedad de materiales como cristales, cerámica y vidrio.
3. Máquina cortadora de precisión con una cubierta impermeable para evitar salpicaduras y que se puede conectar a un sistema de enfriamiento de agua circulante externo para proteger las muestras de altas temperaturas.

  • Shenyang Kejing
  • Shenyang, China
  • 10 días laborables
  • 50 juegos
  • información
(opcional)

(opcional)

Garantía:

· Garantía limitada de un año con soporte de por vida (sin incluir piezas oxidadas debido a condiciones de almacenamiento inadecuadas)

Logística:

Sobre nosotros:

Shenyang Kejing Auto-instrument Co., Ltd. se fundó en mayo de 2000. Shenyang Kejing se ha mantenido como líder en el campo de los equipos de análisis de materiales. Actualmente, la compañía cuenta con cientos de productos que abarcan corte, rectificado, pulido, recubrimiento de película, mezcla, laminado y prensado, sinterización, análisis y otras áreas, así como consumibles relacionados, que satisfacen las necesidades de equipos completos de preparación y análisis de muestras para cristal, cerámica, vidrio, roca, minerales, materiales metálicos, materiales refractarios, materiales compuestos y materiales biológicos.

· The saw is equipped with precision vacuum chuck of 8'' with 200mm OD of wafers. Precision Dicing Saw uses a Ø220mm sample holding plate and the cutting distance is up to 200mm×200mm.

· Proper blade and blade clamps can be selected according to the size of materials

 

Technical Parameters of Dicing Saw

Product Name

SYJ-800 CNC Dicing / Cutting Saw

Product Model

SYJ-800

Dicing Saw Installation conditions

1. Dicing Saw temperature and humidity: 10-85%RH (at 25℃ without condensation) Temperature: 0-45℃.

2. There is no strong vibration source and corrosive gas around the equipment.

3. Dicing Saw power supply: AC110V 60Hz American standard three-pole socket (customized machine)

AC220V 50Hz national standard three-pole socket

4. Cooling water: The Dicing Saw is equipped with an inlet and a drain, and you need to connect the tap water and drainage device by yourself

5. Dicing Saw air source: no requirement for standard equipment

6. Workbench: Dicing Saw size 800mm×600mm×700mm, Dicing Saw load-bearing more than 50kg

7. Dicing Saw Ventilation device: good ventilation environment, no special ventilation device requirements

Precision Wafer Saw Major Parameters

(Specification)

1. Wafer Saw power supply port: AC220V 50Hz 10A

2. Wafer Saw spindle speed: 0-3000rpm stepless speed regulation

3. Wafer Saw spindle drive power: 180W

4. X-axis slide stroke: 200mm

5. Y-axis slide stroke: 200mm

6. Z-axis slide stroke: 55mm

7. Processable dicing depth: 1.3mm

8. Wafer Saw max cutting depth: 10mm

9. X/Y/Z-axis drive motor: high-precision stepper motor

10. Stepper motor positioning accuracy: 0.01mm

11. Wafer Saw workbench angle and error: 360°±0.02°

12. Wafer Dicing Machine Carrier plate diameter: Glass: φ220mm

13. Wafer Dicing Machine Vacuum suction cup diameter: φ203.2mm (8 inches)

14. Wafer Dicing Machine Saw blade size: Outer diameter: Ø100/Ø150mm Inner diameter: Ø12.7mm

15. Wafer Saw host control method: Computer program (USB)

16. Precision Wafer Saw specifications:

·Wafer Saw Size: 700mm×530mm×710mm

·Wafer Saw Weight: ≈55kg

Precision Slicing Machine

Precision Dicing Saw Notes:

1. Precision Dicing Saw domestic standard power supply of the equipment is AC220V 50Hz. Precision Dicing Saw actual power supply parameters are subject to the label attached to the back of the product.

2. Precision Dicing Saw supports customized AC110V 60Hz power supply equipment.

3. To use this Precision Dicing Saw , you need to bring your own computer as the device control host. The device comes with a "U disk installation program".



Wafer Dicing Machine Standard Accessories:

No.

name

qty

picture

1

Saw Pads 

4 sets in total

Dicing Saw 

2

Glass Tray

1 set

 Wafer Saw

3

Resin Ceramic Blocks 

2 pieces

 Precision Slicing Machine

4

Full Sintered Diamond Blade

(Ø100mmר12.7mm×0.33mm)

1 piece

 Dicing Saw

5

Electroplated Diamond Blade

(Ø100mmר12.7mm×0.4mm)

2 pieces

 Wafer Saw

6

Sintered Diamond Scribing Blade

(Ø86mmר70mm×0.15mm)

1 piece

 Precision Slicing Machine

7

Wax Bar

4 pieces

 Dicing Saw

8

Dicing Blade Clamp

1 set

 Wafer Saw

9

Goggles

1 pair

Precision Slicing Machine

10Oilless Vacuum Pump1 set                       

Dicing Saw



Wafer Dicing Machine Optional Accessories:

No.

name

functional type

picture

1

Fully Sintered Diamond Blade

Ø100mmר12.7mm×0.35mm
Ø76mmר12.7mm×0.23mm

(optional)

Wafer Saw

2

Edge Sintered Diamond Saw Blade

Ø100mmר12.7mm×0.4mm,
Ø150mmר12.7mm×0.5mm

(optional)

Precision Slicing Machine

3

Sintered Diamond Dicing Scribing Blade

Ø86mmר70mm×0.15mm

(optional)

 Dicing Saw

4

MTI series heating platform

(optional)

Wafer Saw



Warranty:

· One year limited with lifetime support (not including rusted parts due to inadequate storage conditions)



Logistics:

Precision Slicing Machine

About Us:

Shenyang Kejing Auto-instrument Co., Ltd. was established in May 2000. Shenyang Kejing has been keeping the goal of leading the trend in the field of material analysis equipment. Up to now, the company has hundreds of products covering material cutting, grinding, polishing, film coating, mixing, rolling & pressing, sintering, analyzing and other fields as well as related consumables, which can meet the requirements on complete sets of sample preparation and analysis for crystal, ceramics, glass, rock, mineral, metal materials, refractory materials, composite materials, and biological materials.

Dicing Saw

Plataforma de calentamiento de la serie MTI
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